IBM, 3M Glue Join Hands to Build 1000 Times Faster PCs

IBM, 3M Glue Join Hands to Build 1000 Times Faster PCs

Since technology is skyrocketing at the velocity of knots, inventions, discoveries and advancements have no longer remained a novelty. And for IBM, the 100-year-old (and counting) International Business Machine, advancements are nothing more than a recurrent prodigy.

No wonder the New Yorker is all in readiness to bare its aces, once more.

According to latest reports from Armonk-based IBM headquarter; the world will soon witness a whole new generation of smartphones and computers that will be nearly 1000 times faster and better than the system we use in this day and age.

IBM is reportedly working over the upcoming generation of computers dubbed "skyscraper".

During the initial resource and development stage of "skyscraper", the revolutionizing computer that will reportedly roll out in 2013, IBM is relying on numerous titanic squeeze-in (of silicon chips) by fixing sheet of chips enclosed by minuscule workings.

For the process, IBM is assisted by adhesive maker "glue maker 3M". The joint venture will manufacture smartphones and computers nearly 1000 times faster than those we use today.

At present, 3M Glue manufactures adhesives and ultra-fine heat resistant glues for aerospace engineering.

In addition, it also develops sticky tapes, though the upcoming venture is of high stakes for the adhesive maker. The hi-tech adhesives, which 3M, has developed for IBM can if fact turn out to be the most imperative and evolutionary soar in the elephantine cosmos of technology and computing.


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